Effects of SPS concentration on electrodeposition and morphology of copper coatings

Abstract The entire manufacturing chain of the chip, the surface engineering technology represented by electrochemical deposition technology, plays a very important role in supporting it. This paper delves into the impact of brightener (SPS) concentration on the copper electroplating behavior within the electroplating solution, employing electrochemical testing methods. Following this analysis, copper electroplating experiments are conducted to obtain the electroplated layers. Ultimately, the study examines the influence of brightener concentration on the surface morphology of these copper electroplating layers using surface profilometry and X-ray diffraction (XRD) analysis. The experimental findings reveal that an increase in the concentration of the brightener (SPS) leads to an enhancement in the brightness of the plated surface.