Optimization of the Composition of a Thermally Resistant Dielectric Organosilicate Coating Based on Ladder Polymer Polyphenylsilsesquioxane

This article presents the results of a study on protective, dielectric, and thermally resistant organosilicate coatings (OSCs) based on a ladder polymer, polyphenylsilsesquioxane (PPSQ), which is used as a film-forming agent. For the first time, a classical approach is employed to calculate the formulations of pigmented coatings in relation to organosilicate compositions (OSComps). The average viscosity molecular weight of the selected film-forming agent PPSQ is determined. The developed coatings exhibit high thermal resistance up to 420°C while maintaining the necessary physicomechanical and electrophysical properties.