Research Process and Prospects of Power Device Interconnection Technology

As power devices continue to evolve, the range of interconnection methods for power chips has expanded to satisfy diverse conduction requirements. During power chip packaging, the interconnection process plays a vital role in fully realizing the performance of power devices. Different interconnection solutions can significantly influence packaging reliability and performance metrics. This paper reviews how interconnection technologies have evolved alongside the development of power devices, summarizes the process characteristics, technical features, and application cases of various interconnection methods, and discusses future trends in interconnection technology.