Application of System in Package Technology in Rf System

In recent years, with the increasing maturity of micro-nano integration technology, RF systems are developing in the direction of microsystems, and RF circuits are urgently required to achieve miniaturization and high-density integration. Advanced packaging is currently the hottest cutting-edge technology in the field of integrated circuits. System-in-package (SiP) technology is the most effective technical route to achieve RF system miniaturization in the field of advanced packaging. Based on SiP technology, two packaging schemes are used to realize three-dimensional heterogeneous integration of logic control circuits in traditional RF systems, which greatly reduces the circuit size and improves the integration density. Finally, the two schemes are compared in this paper.