Simulation Study on Wire Mesh CPU Heat Sink Based on Geometric Optimization of Porous Structures

To address the heat dissipation challenges of high-power-density electronic devices, this paper proposes a copper wire mesh CPU heat sink design method based on rhombus-shaped pore optimization. A three-dimensional periodic unit model was established using COMSOL Multiphysics to systematically compare the flow and heat transfer characteristics of copper wire meshes with rhombus-shaped pores (varying internal angles) and square pores. Simulation results indicate that the rhombus-shaped pores with <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$60^{\circ} / 120^{\circ}$</tex> internal angles exhibit the best comprehensive performance. The sharp-angle geometry induces vortices, enhancing near-wall turbulent kinetic energy transport, thereby increasing the surface heat transfer coefficient by 2.21 % and reducing thermal resistance by 2.17 %. Meanwhile, the obtuse angles suppress flow separation, shortening the recirculation zone length, with only a 3.66 % increase in pressure drop. The study demonstrates that the geometric asymmetry of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$60^{\circ} / 120^{\circ}$</tex> rhombus-shaped pores achieves synergistic optimization of heat transfer enhancement and flow resistance. The performance gains may exhibit nonlinear amplification effects in macroscopic systems, providing new insights for high-power-density heat sink design.