Research on Thermal Management of 3D Embedded Microchannel Modules Applied to T/R Module

The phased array radar T/R (transmit/receive) module is faced with increasing power and heat accumulation under extreme operating conditions. To ensure the reliability of the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$T / R$</tex> module with <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$3 D$</tex> integration miniaturization, thermal design research is required. In this paper, a printed circuit board (PCB) module with embedded channels is investigated and a thermal test chip (TTC) is used to simulate the heat generation of the power amplifier (PA). The thermal simulation model is established using multi-physics field finite element calculation software, and test samples are fabricated and tested to verify the effectiveness of the structural design and model development. The results show that the 3D cooling structure based on embedded microfluidic cooling can meet the cooling demand of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$150 ~\text{W} / \text{cm}$</tex> for <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$T / R$</tex> modules through simulation calculation and experimental verification. In addition, the three-dimensional cooling module can serve higher module thermal management requirements in the future.