A Novel Method for TIM Thermal Characteristics Measurement in Package Based on Thermal Test Chips

Thermal interface materials are widely used in the field of electronic packaging, and accurately characterizing the thermal properties of these materials is crucial for thermal management in semiconductor packaging. This paper proposes an innovative testing method for thermal interface materials based on the steady-state heat source method. The new approach integrates the temperature measurement sensors and heating modules onto a single thermal test chip, demonstrating the integration of the testing structure. Results show that this novel method for testing the thermal characteristics of thermal interface materials can be applied to various types of materials, proving its practicality. The method offers significant advantages in terms of testing efficiency and convenience.