Using modern polymer-inorganic composite materials with electronic conductivity increasing the fault tolerance of electronic devices

Recently, we can observe steady increase in the power of computing equipment, not least of which is due to emergence of multiprocessor computing systems and multicore processors, when several cores of one processor can be implemented in the conditions of one microcircuit. Not least of all, SOC (system on chip) chips have contributed to the increase in operating temperatures, in which almost the entire laptop is built as part of one processor. In general, any computer components based on semiconductors heat up in one way or another during operation. At the same time, technologies are developing, power/fre-quency/speed are increasing, and therefore heat dissipation is also increasing.In addition, more and more manufacturers prefer ultra-thin product designs, we can see ultra-thin TVs, laptops, tablet computers, etc. much more often. All this, while packing more and more power into a smaller volume of products, leads to the increase in thermal load and difficulty in ventilation. Artificial ventilation and cooling are no longer able to reduce tempera-tures to the level that was 5-10 years ago.The problem of studying failures of electronic equipment is global in nature, not least these failures are caused by a change in the resistance of solder flux residues, which, under the influence of a number of factors, can change their parameters. Unfortunately, in Ukraine, due to the decline in the production of electronic equipment, this issue has not been raised recently, but in the world space this problem remains relevant and may reach a new level, since in recent times production of electronic equipment has been rapidly developing. One example is the factor of the rapid increase in laptop sales, which is due to the Coronavirus pandemic, which provoked a sharp demand for mobile PCs. If in pre-pandemic 2019 the average age of a home laptop was 6 years, then the mass transition to remote work required their renewal.Based on the above, we can conclude that despite wide distribution of no-wash fluxes, their residues, under certain conditions, can to some extent affect the trouble-free operation of electronic equipment for the assembly (formation of solder joints) of which they were used. Therefore, there is still some room for research related to operating conditions of electronic products, including increased vibration (typical of control modules of mobile equipment). increased humidity and, which has recently become increasingly relevant, increased operating temperatures of products, which are due to growing computing power, ultra-thin design, and the associated complexity of artificial ventilation.