Vat Photopolymerization of Al ₂ O ₃ /Borosilicate Glass Low Temperature Co-Fired Ceramic Substrates With Integrated Micropore Patterning Device

Low temperature co-fired ceramics (LTCC) have garnered significant attention due to their exceptional electrical and thermal properties. While the traditional tape casting method for preparing LTCC substrates yields high density, it is constrained by limited geometric freedom and a complex process, making it less suitable for contemporary demands. In this study, we employ vat photopolymerization 3D printing technology to fabricate alumina/borosilicate glass composite LTCC systems and introduce a microporous structure design on the substrate. This innovation simplifies the traditional punching step, enhancing both productivity and reliability. We formulated LTCC slurry suitable for vat photopolymerization and examined the thermal conductivity and dielectric properties of the sintered parts. The findings reveal that samples held at 750 °C for 30 minutes achieved the highest densities, exhibiting a thermal conductivity of 3.63 W·m<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup>·K<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup>, a relative dielectric constant of 13.09, and the lowest dielectric loss (7.9 × 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−3</sup>). We successfully realized microporous printing on LTCC substrates, achieving microporous structures with an actual diameter of 132 μm. Additionally, we verified the compatibility of substrates with silver co-firing, observing a robust bond between the silver layer and the LTCC layer. This study underscores the potential of vat photopolymerization for LTCC applications.