A Novel Seal Packaging Structure Applied in Sub Miniature Push-On Connector Based on Ni47Ti44Nb9 Shape Memory Alloy Seal Ring

At present, the tin-lead vacuum soldering process is commonly used to complete the seal packaging of Sub miniature push-on (SMP) connectors. However, when the number of SMP connectors exceeds thousands, it is difficult to guarantee the consistency of soldering, which greatly restricts the large-scale application of SMP connectors. Fortunately, Shape Memory Alloy (SMA) materials have the good low-temperature phase change characteristics and could produce a big fasten force, thus can be used for seal packaging of SMP connectors. Therefore, this paper proposes a novel seal packaging structure for SMP connectors based on the Ni47Ti44Nb9 SMA seal ring to solve the problem of seal packaging of SMP connectors. In view of the SMA’s good performance, three seal packaging structure forms for SMP connectors based on the SMA seal ring are proposed, which are named as structure A, structure B and structure C, respectively. The characteristics of the seal packaging structures of each form is briefly described. The comparative study is carried out on the three structure forms with the seal packaging leakage rate as the target. The test results demonstrate that structure A can provide the best sealing performance while taking up the least space, which meets the requirement of the normal application of electronic communications equipment. Then, the further research on structure A is conducted, a prediction model of seal packaging leakage rate is established with the response surface method (RSM), by which the relationship between the structural parameters including the wall thickness of seal ring, the roughness, the thin wall thickness of cavity and the seal packaging leakage rate is investigated. Finally, to reduce the seal packaging leakage rate, the structural parameters of the seal ring are further optimized with an improved Adaptive Genetic Algorithm (IAGA), and the efficiency of the IAGA is verified through comparison with the conventional Adaptive Genetic Algorithm (AGA).

Authors

Institutions

Publication Details

Journal
IEEE Access
Published
2025-01-01
DOI
https://doi.org/10.1109/access.2025.3597999
Primary Topic
Shape Memory Alloy Transformations
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

A Novel Seal Packaging Structure Applied in Sub Miniature Push-On Connector Based on Ni47Ti44Nb9 Shape Memory Alloy Seal Ring

Cong Lu, Yang Hai
IEEE Access
Shape Memory Alloy Transformations
article

A Novel Seal Packaging Structure Applied in Sub Miniature Push-On Connector Based on Ni47Ti44Nb9 Shape Memory Alloy Seal Ring

Cong Lu, Yang Hai
article en

Abstract

At present, the tin-lead vacuum soldering process is commonly used to complete the seal packaging of Sub miniature push-on (SMP) connectors. However, when the number of SMP connectors exceeds thousands, it is difficult to guarantee the consistency of soldering, which greatly restricts the large-scale application of SMP connectors. Fortunately, Shape Memory Alloy (SMA) materials have the good low-temperature phase change characteristics and could produce a big fasten force, thus can be used for seal packaging of SMP connectors. Therefore, this paper proposes a novel seal packaging structure for SMP connectors based on the Ni47Ti44Nb9 SMA seal ring to solve the problem of seal packaging of SMP connectors. In view of the SMA’s good performance, three seal packaging structure forms for SMP connectors based on the SMA seal ring are proposed, which are named as structure A, structure B and structure C, respectively. The characteristics of the seal packaging structures of each form is briefly described. The comparative study is carried out on the three structure forms with the seal packaging leakage rate as the target. The test results demonstrate that structure A can provide the best sealing performance while taking up the least space, which meets the requirement of the normal application of electronic communications equipment. Then, the further research on structure A is conducted, a prediction model of seal packaging leakage rate is established with the response surface method (RSM), by which the relationship between the structural parameters including the wall thickness of seal ring, the roughness, the thin wall thickness of cavity and the seal packaging leakage rate is investigated. Finally, to reduce the seal packaging leakage rate, the structural parameters of the seal ring are further optimized with an improved Adaptive Genetic Algorithm (IAGA), and the efficiency of the IAGA is verified through comparison with the conventional Adaptive Genetic Algorithm (AGA).

IEEE AccessVol. 13
University of Electronic Science and Technology of China (CN)
Affordable and clean energy
Openalex Percentile: Top 85%
Shape Memory Alloy Transformations
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.