Glass-like thermal conductivity in higher manganese silicides with grain boundary nanostructures

Higher manganese silicides (HMSs) have emerged as promising candidates for environmentally friendly thermoelectric (TE) materials due to their earth-abundant and non-toxic composition. We report grain boundary engineering in ruthenium-doped HMSs via a melt-quenching followed by annealing method. This approach promotes the formation of MnSi nanoprecipitates and nanopores, preferentially near grain boundaries. The presence of these nanostructures results in a weak temperature-dependent thermal conductivity, resembling glass-like thermal transport behavior. A two-channel model incorporating propagons and diffusons describes this glass-like thermal conductivity, with diffusons contributing about 60 % of the lattice thermal conductivity at 300 K. Furthermore, the quench-annealing process enhances electrical conductivity while preserving a large Seebeck coefficient, which is attributed to a high density-of-states effective mass. As a result of improved power factor and reduced thermal conductivity, the figure of merit zT value increases by 33 % at 300 K compared to undoped HMS synthesized via solid-state reaction. These findings present a promising strategy for manipulating phonon dynamics in functional materials and designing efficient TE systems.

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Publication Details

Journal
Materials Today Electronics
Published
2025-08-12
DOI
https://doi.org/10.1016/j.mtelec.2025.100169
Primary Topic
Semiconductor materials and interfaces
Type
article
Field-Weighted Citation Impact
0.00

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article

Glass-like thermal conductivity in higher manganese silicides with grain boundary nanostructures

Jianshi Zhou, Li Shi, Shucheng Guo, Shuchen Li et al.
Materials Today Electronics
Semiconductor materials and interfaces
article

Glass-like thermal conductivity in higher manganese silicides with grain boundary nanostructures

Jianshi Zhou, Li Shi, Shucheng Guo, Shuchen Li, Youming Xu, Xi Chen
article en

Abstract

Higher manganese silicides (HMSs) have emerged as promising candidates for environmentally friendly thermoelectric (TE) materials due to their earth-abundant and non-toxic composition. We report grain boundary engineering in ruthenium-doped HMSs via a melt-quenching followed by annealing method. This approach promotes the formation of MnSi nanoprecipitates and nanopores, preferentially near grain boundaries. The presence of these nanostructures results in a weak temperature-dependent thermal conductivity, resembling glass-like thermal transport behavior. A two-channel model incorporating propagons and diffusons describes this glass-like thermal conductivity, with diffusons contributing about 60 % of the lattice thermal conductivity at 300 K. Furthermore, the quench-annealing process enhances electrical conductivity while preserving a large Seebeck coefficient, which is attributed to a high density-of-states effective mass. As a result of improved power factor and reduced thermal conductivity, the figure of merit zT value increases by 33 % at 300 K compared to undoped HMS synthesized via solid-state reaction. These findings present a promising strategy for manipulating phonon dynamics in functional materials and designing efficient TE systems.

Materials Today ElectronicsVol. 13
University of California, Riverside (US), The University of Texas at Austin (US)
National Science Foundation
Openalex Percentile: Top 85%
Semiconductor materials and interfaces
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Glass-like thermal conductivity in higher manganese silicides with grain boundary nanostructures — Jianshi Zhou, Li Shi, et al. · Materials Today Electronics (2025) | TGRS Research Map | TGRS