Usb Type-C Receptacle Connector with Ceramic Insulator and Three-Layer Ground Plates

This paper proposes a novel USB Type-C receptacle connector with a ceramic insulator and three-layer ground plates. In the conventional manufacturing method involving injection molding process, multi-layer ground plates cannot be realized, and a single ground plate must include open areas for injection molding fixation and silicone potting. The defected metal ground plate may leak RFI. Hybrid Integrated circuit (HIC) processes and high-temperature co-fired ceramic (HTCC) technology used in this work enable the implementation of three metal plates and the use of ceramics. The three metal plates result in a reduction of RFI by up to 4.7 dB for RX1 and 10 dB for TX1 across the frequency range of 0.5 to 3 GHz compared with the commercial USB Type-C receptacle connector. The use of alumina ceramic demonstrated excellent reliability, with the extraction force measured at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1.82 \text{kg} \cdot \mathrm{f}$</tex> initially and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1.78 \text{kg} \cdot \mathrm{f}$</tex> after 20,000 cycles of insertion and extraction.