A D-Band TX Fowlp Module with Silicon-Based Resonator Antenna Array

This work presents a D-band phased array transmitter (Tx) module that integrates multiple RFICs with antenna-in-package (AiP) technology, implemented using Fan-Out Wafer Level Packaging (FOWLP). The module features four CMOS <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$160-\text{GHz}$</tex> beamforming multiplier chains, each connected to a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1 \times 4$</tex> series-fed antenna array, forming a total array aperture of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$4.2 \times 4.2 \mathbf{m m}^{2}$</tex>. To address thermomechanical challenges such as warpage and die shift during the wafer-level backend fabrication process, dummy silicon chips are strategically placed within the package. The array achieves a broadside radiation pattern, with a measured phased array gain of 14.3 dBi and an effective isotropic radiated power (EIRP) of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$7.1 \mathbf{dBm}$</tex> at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{1 6 0 GHz}$</tex>. It supports a scanning range of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\pm 40^{\circ}$</tex> in the elevation plane. This work highlights a robust solution to thermomechanical issues while ensuring reliable electrical and mechanical performance, marking significant progress in the development of high-frequency, large-scale phased array modules for next-generation communication systems, radar, and sensing applications.