Deep Level Effects and Hot-Electron Reliability in Scaled GaN HEMTs

Carbon-related defects, introduced as doping or due to contamination during MOCVD growth, can induce dispersion effects and threshold voltage instability in GaN-based HEMTs. Back-barriers, consisting of wider bandgap materials, are adopted in order to separate channel electrons from C -doped buffers, and to reduce short-channel effects; however, trapping at GaN/back-barrier interface may still be present. Deep level effects in different ‘bufferless’ HEMTs technologies are discussed on the basis of case histories.

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Publication Details

Published
2025-06-15
DOI
https://doi.org/10.1109/ims40360.2025.11103980
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26

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article en
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Abstract

Carbon-related defects, introduced as doping or due to contamination during MOCVD growth, can induce dispersion effects and threshold voltage instability in GaN-based HEMTs. Back-barriers, consisting of wider bandgap materials, are adopted in order to separate channel electrons from C -doped buffers, and to reduce short-channel effects; however, trapping at GaN/back-barrier interface may still be present. Deep level effects in different ‘bufferless’ HEMTs technologies are discussed on the basis of case histories.

University of Padua (IT)
Office of Naval Research Global
Affordable and clean energy
Openalex Percentile: Top 19%
GaN-based semiconductor devices and materials
1.26
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