Equation-Based Solver for High-Performance SI CuMax Routing Within Pin Fields

This work presents an equation-based solver for the rapid signal integrity (SI) performance calculation of a novel CuMax routing structure, utilizing an electric field compliant geometrical discretization (ECGD) field model. The resistance-inductance-conductance-capacitance (RLGC) matrix of the routing structure is systematically analyzed to derive the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$S$</tex> parameters. The proposed solver demonstrates high predictive accuracy in calculating the SI performance of practical DDR5 channels. The results indicate a maximum deviation of only <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{4. 3 7 \%}$</tex> in time-domain reflectometry (TDR) impedance when compared to numerical simulation benchmark results from Ansys HFSS, while achieving a simulation time speedup of approximately <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$529 x$</tex>. This combination of high accuracy and computational efficiency in SI performance calculation underscores the efficacy and potential of the proposed approach for CuMax routing designs in next-generation microwave communication systems and beyond, which demand compact sizes and high SI.