3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package

This work presents a manufacturing platform for the vertically stacking of glass substrates with heterogeneously integrated surface mount devices for advanced RF systems-inpackage, including the design, fabrication, and assembly of a true 3D Heterogeneously Integrated vertically assembled half-duplex <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$6-12 \text{GHz}$</tex> Tx-Rx module using 4 stacked glass layers with 14 embedded components. The half-duplex RF system performance are excellent in three assembled modules as designed and simulated and measured.