Evaluation of Stacked Structure for 160 Ghz End-Fire Type Compact Antenna-in-Package Considering Thermal Design
Stacking multiple antenna-in-packages (AiPs) for beam scanning leads to increased heat generation, which can degrade RF characteristics such as power amplifier output. A three-dimensional layered structure of the AiP is proposed, featuring an end-fire antenna that excels in thermal management and low-loss performance. Modeling of the heat dissipation pathway is conducted using a thermal equivalent circuit. A prototype of an AiP operating in the 160 GHz band was fabricated. Thermal evaluation and received power assessment were performed for a two-layer stacked configuration of the AiP. The proposed layered structure demonstrated a 6 dB increase in received power and the capability for two-dimensional beam scanning.
Authors
- Chenxin Liu (ORCID: https://orcid.org/0000-0002-5645-3688)
- Sunghwan Park (ORCID: https://orcid.org/0000-0002-1133-3500)
- Takashi Tomura (ORCID: https://orcid.org/0000-0002-9272-8298)
- Koji Takinami
- Yudai Yamazaki (ORCID: https://orcid.org/0000-0001-9061-541X)
- Tomohiro Murata
- Ryosuke Hasaba (ORCID: https://orcid.org/0000-0001-5202-7641)
- Akihiro Egami
- Tomoki Abe (ORCID: https://orcid.org/0000-0002-5054-5477)
- Kenichi Okada (ORCID: https://orcid.org/0000-0002-1082-7672)
- T. Uchino (ORCID: https://orcid.org/0000-0001-6412-7658)
- Jun Sakamaki
- Hiroyuki Sakai (ORCID: https://orcid.org/0000-0003-1168-0323)
- Ken Takahashi
- Makoto Tsukahara
- Yoichi Nakagawa
- M. Suzuki
- Yohei Morishita (ORCID: https://orcid.org/0000-0002-4184-7182)
Institutions
- Panasonic (Japan) (JP)
- Shinko Electric Industries (Japan) (JP)
Publication Details
- Published
- 2025-06-15
- DOI
- https://doi.org/10.1109/ims40360.2025.11103916
- Primary Topic
- Antenna Design and Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Ministry of Internal Affairs and Communications