Graph Sequence-Based Prediction of Electrothermal Stress Evolution for Power Delivery Networks
With the advancement of integrated circuit technology, electrothermal migration (EM-TM) in power delivery networks (PDNs) has become a key reliability challenge. Existing machine learning methods are unable to capture the evolution trajectory of EM-TM stress and actively predict the lifetime of PDNs. We propose a spatiotemporal graph-based prediction framework that integrates spatial structural features and captures early stress accumulation patterns from input sequence, enabling long-term forecasting of EM-TM coupling evolution. The experimental results show that our approach achieves higher prediction accuracy and stability on PDNs datasets spanning up to 1,500 interconnect segments, delivering near 5× speedup in prediction compared to the single-timestep model and 6896× acceleration over the commercial software COMSOL. Furthermore, the framework enables reliable PDNs lifetime estimation with millisecond computation time.
Authors
- Pinquan Li (ORCID: https://orcid.org/0009-0009-2196-4195)
- Jiajun Shen (ORCID: https://orcid.org/0000-0002-5042-0201)
- Yuwei Sun (ORCID: https://orcid.org/0009-0002-9587-0596)
- Longxing Shi (ORCID: https://orcid.org/0000-0002-0629-7154)
- Hao Yan
- Yunfan Zuo
Institutions
- Southeast University (CN)
Publication Details
- Published
- 2025-05-09
- DOI
- https://doi.org/10.1109/iseda65950.2025.11100562
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Jiangsu Province
- Research and Development