Graph Sequence-Based Prediction of Electrothermal Stress Evolution for Power Delivery Networks

With the advancement of integrated circuit technology, electrothermal migration (EM-TM) in power delivery networks (PDNs) has become a key reliability challenge. Existing machine learning methods are unable to capture the evolution trajectory of EM-TM stress and actively predict the lifetime of PDNs. We propose a spatiotemporal graph-based prediction framework that integrates spatial structural features and captures early stress accumulation patterns from input sequence, enabling long-term forecasting of EM-TM coupling evolution. The experimental results show that our approach achieves higher prediction accuracy and stability on PDNs datasets spanning up to 1,500 interconnect segments, delivering near 5× speedup in prediction compared to the single-timestep model and 6896× acceleration over the commercial software COMSOL. Furthermore, the framework enables reliable PDNs lifetime estimation with millisecond computation time.

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Publication Details

Published
2025-05-09
DOI
https://doi.org/10.1109/iseda65950.2025.11100562
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.00

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article

Graph Sequence-Based Prediction of Electrothermal Stress Evolution for Power Delivery Networks

Pinquan Li, Jiajun Shen, Yuwei Sun, Longxing Shi et al.
Copper Interconnects and Reliability
article

Graph Sequence-Based Prediction of Electrothermal Stress Evolution for Power Delivery Networks

Pinquan Li, Jiajun Shen, Yuwei Sun, Longxing Shi, Hao Yan, Yunfan Zuo
article en

Abstract

With the advancement of integrated circuit technology, electrothermal migration (EM-TM) in power delivery networks (PDNs) has become a key reliability challenge. Existing machine learning methods are unable to capture the evolution trajectory of EM-TM stress and actively predict the lifetime of PDNs. We propose a spatiotemporal graph-based prediction framework that integrates spatial structural features and captures early stress accumulation patterns from input sequence, enabling long-term forecasting of EM-TM coupling evolution. The experimental results show that our approach achieves higher prediction accuracy and stability on PDNs datasets spanning up to 1,500 interconnect segments, delivering near 5× speedup in prediction compared to the single-timestep model and 6896× acceleration over the commercial software COMSOL. Furthermore, the framework enables reliable PDNs lifetime estimation with millisecond computation time.

Southeast University (CN)
National Natural Science Foundation of China, Natural Science Foundation of Jiangsu Province, Research and Development
Openalex Percentile: Top 87%
Copper Interconnects and Reliability
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Graph Sequence-Based Prediction of Electrothermal Stress Evolution for Power Delivery Networks — Pinquan Li, Jiajun Shen, et al. · (2025) | TGRS Research Map | TGRS