A D-Band $\times 15$ Frequency Multiplier Chain in 45 NM SiGe BiCMOS for Board-Level Packaged Array Applications

This paper presents a D-band frequency multiplier chain in 45 nm SiGe BiCMOS technology. It achieves a high multiplication factor of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{1 5}$</tex> for large multi-chip packaged array applications. The design consists of a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\times 5$</tex> low-frequency multiplier, an interstage buffer, and a D-band tripler that directly drives the 50 ohm load. The bandwidth extension technique is applied with an electrically coupled transformer and a harmonic filter is implemented between the cascode transistors of the tripler to enhance the harmonic rejection ratio. The frequency multiplier chain operates from 123 GHz to 136 GHz with a saturated output power (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$P_{\text {sat }}$</tex>) of 1.1 dBm, a conversion gain of 2.9 dB, and a harmonic rejection ratio between 19.8 dB and 22 dB. The total DC power consumption of the design is 80 mW.

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Publication Details

Published
2025-06-15
DOI
https://doi.org/10.1109/ims40360.2025.11103771
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
0.00

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article

A D-Band $\times 15$ Frequency Multiplier Chain in 45 NM SiGe BiCMOS for Board-Level Packaged Array Applications

Boxun Yan, Runzhou Chen, Mau-Chung Frank Chang, Hao-Yu Chien et al.
Radio Frequency Integrated Circuit Design
article

A D-Band $\times 15$ Frequency Multiplier Chain in 45 NM SiGe BiCMOS for Board-Level Packaged Array Applications

Boxun Yan, Runzhou Chen, Mau-Chung Frank Chang, Hao-Yu Chien, Chih-Kong Ken Yang, Christopher S. Chen
article en

Abstract

This paper presents a D-band frequency multiplier chain in 45 nm SiGe BiCMOS technology. It achieves a high multiplication factor of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{1 5}$</tex> for large multi-chip packaged array applications. The design consists of a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\times 5$</tex> low-frequency multiplier, an interstage buffer, and a D-band tripler that directly drives the 50 ohm load. The bandwidth extension technique is applied with an electrically coupled transformer and a harmonic filter is implemented between the cascode transistors of the tripler to enhance the harmonic rejection ratio. The frequency multiplier chain operates from 123 GHz to 136 GHz with a saturated output power (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$P_{\text {sat }}$</tex>) of 1.1 dBm, a conversion gain of 2.9 dB, and a harmonic rejection ratio between 19.8 dB and 22 dB. The total DC power consumption of the design is 80 mW.

University of California, Los Angeles (US)
Defense Advanced Research Projects Agency
Openalex Percentile: Top 81%
Radio Frequency Integrated Circuit Design
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