Parallel Differential-Line Fed Planar Aperture Antenna-in-Package with Signal Lines Isolated from IC in 300-GHz Band

A low-loss antenna-in-package (AiP) with parallel differential-line isolated from the IC is developed in 300-GHz band. An X-shaped patch enables the antenna to be fed via parallel differential-line from the IC. Double resonance is achieved through the X-shaped patch and the apertures within the multilayer substrate. By leveraging electromagnetic coupling for feeding, the proposed design achieves low loss. By enclosing the antenna signal lines with via holes and bumps, radio wave leakage can be prevented, and the isolation between the antenna and the IC can be increased. The performance and effectiveness of this AiP design are validated through both electromagnetic simulations and measurements.