Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity

As semiconductor devices demand higher input-output density and faster signal transmission, fan-out panel-level packaging has emerged as a promising solution for next-generation electronic systems. However, the hygroscopic nature of epoxy molding compounds raises critical reliability concerns under high-temperature and high-humidity conditions. This study investigates the hygrothermal stress of a single fan-out panel-level package unit through experimental characterization and numerical simulation. Thermal-mechanical analysis was conducted at 100 °C and 260 °C to evaluate the strain behavior of two commercial epoxy molding compounds in granule form after moisture saturation. The coefficient of moisture expansion was calculated by correlating strain variation with moisture uptake obtained under 85 °C and 85% relative humidity, corresponding to moisture sensitivity level 1 conditions. These values were directly considered into a moisture -thermal coupled finite element analysis. The simulation results under reflow conditions demonstrate accurate principal stress and failure location predictions, with stress concentrations primarily observed at the die corners. The results confirm that thermal effects influence stress development more than moisture effects. Finally, a structural sensitivity analysis of the single-package configuration showed that optimizing the thickness of the dies and epoxy molding compound can reduce maximum principal stress by up to 12.4%, providing design insights for improving package-level reliability.