Design and fabrication of 4 double input NAND gate chip with excellent electrical and physical performances

In order to improve the performances of 4 two-input NAND so that it can be better used in the aerospace application field and in harsh environments, 4 two-input NAND gate chips were designed and successfully fabricated in this paper, based on 1.2 [Formula: see text]m P-well SPDM CMOS technological processes. The N transistors were fabricated in P-well and connected to GND via [Formula: see text]-well. The metal wires of [Formula: see text] use [Formula: see text] substrate to contact [Formula: see text], to increase its anti-locking capability. An ESD protection circuit was designed at the input terminals, prohibiting the terminal of IC chip from being damaged by ESD stress. The performance of the device is superior to that of other similar products in the world.

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Publication Details

Journal
Scientific Reports
Published
2025-08-11
DOI
https://doi.org/10.1038/s41598-025-14874-4
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Design and fabrication of 4 double input NAND gate chip with excellent electrical and physical performances

Yongshun Wang, Wenqiang Dang, Yu Lu, Lijun Zhang
Scientific Reports
Semiconductor materials and devices
article

Design and fabrication of 4 double input NAND gate chip with excellent electrical and physical performances

Yongshun Wang, Wenqiang Dang, Yu Lu, Lijun Zhang
article en

Abstract

In order to improve the performances of 4 two-input NAND so that it can be better used in the aerospace application field and in harsh environments, 4 two-input NAND gate chips were designed and successfully fabricated in this paper, based on 1.2 [Formula: see text]m P-well SPDM CMOS technological processes. The N transistors were fabricated in P-well and connected to GND via [Formula: see text]-well. The metal wires of [Formula: see text] use [Formula: see text] substrate to contact [Formula: see text], to increase its anti-locking capability. An ESD protection circuit was designed at the input terminals, prohibiting the terminal of IC chip from being damaged by ESD stress. The performance of the device is superior to that of other similar products in the world.

Scientific ReportsVol. 15(1)
Lanzhou Jiaotong University (CN), Gansu Great Wall Electrical and Electronics Engineering Research Institute (CN), Tianshui Normal University (CN)
Tianshui Normal University
Openalex Percentile: Top 82%
Semiconductor materials and devices
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