Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance
In this work, we characterize the in-plane and out-of-plane deformation of the dies following the imec die-to-wafer (D2W) bonding flow. By leveraging this result of alignment readout and leveling metrologies on scanner, we could improve the post-D2W bonding overlay performance through scanner precorrection for advanced packaging and heterogeneous integration system.
Authors
- Samuel Suhard
- V. M. Blanco (ORCID: https://orcid.org/0000-0003-3226-2454)
- Anne Jourdain (ORCID: https://orcid.org/0000-0002-5741-3020)
- Imen Jadli
- Koen Kennes (ORCID: https://orcid.org/0000-0002-5987-2167)
- Amir-Hossein Tamaddon (ORCID: https://orcid.org/0000-0003-4566-0697)
- Etienne De Poortere
- Andy Miller (ORCID: https://orcid.org/0000-0001-6103-1685)
- Alex Hsu
Institutions
- ASML (Netherlands) (NL)
Publication Details
- Published
- 2025-06-02
- DOI
- https://doi.org/10.1109/iitc66087.2025.11075428
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00