Electrical test demonstration for 0.55 NA EUV single patterning damascene process

This work presents the development of a single-layer damascene short loop process to evaluate the patterning performance of single-exposure 0.55 NA lithography. Electrical readouts of up to 3cm long meander and fork structures are used to assess yield across various pitch dimensions. Preliminary results demonstrate successful combo yield for pitches from 32nm to 20nm.

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Publication Details

Published
2025-06-02
DOI
https://doi.org/10.1109/iitc66087.2025.11075462
Primary Topic
Advancements in Photolithography Techniques
Type
article
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article

Electrical test demonstration for 0.55 NA EUV single patterning damascene process

Jan Doise, Peter De Schepper, Nobuyuki Fukui, N. Guzman et al.
Advancements in Photolithography Techniques
article

Electrical test demonstration for 0.55 NA EUV single patterning damascene process

Jan Doise, Peter De Schepper, Nobuyuki Fukui, N. Guzman, Víctor M. Blanco Carballo, Cyrus Tabery, Yannick Feurprier, E. P. De Poortere, Kathleen Nafus, K. Vandersmissen, Stéphane Larivière, Chia-Yu Yao, A. Hsu, B. De Wachter, Mahtab Sangghaleh, Yusuke Wako
article en

Abstract

This work presents the development of a single-layer damascene short loop process to evaluate the patterning performance of single-exposure 0.55 NA lithography. Electrical readouts of up to 3cm long meander and fork structures are used to assess yield across various pitch dimensions. Preliminary results demonstrate successful combo yield for pitches from 32nm to 20nm.

Tokyo Electron (Japan) (JP), Inpria (United States) (US), Intel (United Kingdom) (GB), ASML (Netherlands) (NL)
Openalex Percentile: Top 82%
Advancements in Photolithography Techniques
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Electrical test demonstration for 0.55 NA EUV single patterning damascene process — Jan Doise, Peter De Schepper, et al. · (2025) | TGRS Research Map | TGRS