Pathfinding for Molybdenum Hybrid Metallization
In this article, we demonstrate a pathfinding technique for evaluating hybrid metallization using Molybdenum (Mo) in via fills. We first configure a virtual process platform to evaluate mechanical stress and electrical performance of different metallization schemes. We then perform a regression analysis using Monte-Carlo simulation to determine the optimal via Mo profile that satisfies both stress and electrical targets. Using this technique, we can guide the development of future Mo hybrid metallization schemes.
Authors
- Andras Pap
- Joseph Ervin
- Sandy Wen
- Daniel Faken
- Kitae Kim (ORCID: https://orcid.org/0000-0003-0803-3547)
- Benjamin Vincent (ORCID: https://orcid.org/0000-0002-7210-2116)
- Ivan Chakarov
- TaeYeon Oh
- Gonzalo Feijoo
- Mike Simmermacher
Institutions
- R2M Solution (Italy) (IT)
- Lam Research (United States) (US)
Publication Details
- Published
- 2025-06-02
- DOI
- https://doi.org/10.1109/iitc66087.2025.11075384
- Citations
- 1
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.43