Impact of Redundancy and Line Extension on Short-Length Effect in Electromigration Reliability
This study investigates electromigration in a double-redundancy interconnect configuration, commonly found at standard-cell level in the power delivery networks, under downstream electron flow conditions, using both experiments and physics-based simulations. This work sheds light on the critical jL product, (jL)<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf>, in presence of a parallel path. Due to double redundancy, for our samples coming from a 28nm commercial technology node, the critical current density j<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> was found to increase by 1.15-fold and 1.1-fold, for 5% and 20% R-shift failure criteria, respectively. The impact of line extension on (jL)<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> was also investigated. A 37% decrease in (jL)<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">c</inf> was observed for a single line with a passive line extension acting as a sink, undermining the short-length effect, regardless of the failure criterion. For the same target lifetime, a 1.2-fold increase in maximum allowable current density, based on a 50% target failure percentile and 10 years lifetime criterion, was obtained when comparing the single and double redundancy configurations for 5% R-shift.
Authors
- Ivan Ciofi (ORCID: https://orcid.org/0000-0003-1374-4116)
- Houman Zahedmanesh (ORCID: https://orcid.org/0000-0002-0290-691X)
- Dragomir Milojevic (ORCID: https://orcid.org/0000-0001-5915-5160)
- Giuliano Sisto (ORCID: https://orcid.org/0000-0001-8706-4311)
- Simone Esposto (ORCID: https://orcid.org/0009-0004-4809-7806)
- Kristof Croes (ORCID: https://orcid.org/0000-0002-3955-0638)
Institutions
- IMEC (BE)
Publication Details
- Published
- 2025-06-02
- DOI
- https://doi.org/10.1109/iitc66087.2025.11075449
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00