Environment Adaptability Study of Aerospace CSOP Devices

When Ceramic Small Out-Line Package(CSOP) devices are in service under aerospace conditions, the harsh mechanical and thermal load will cause solder joints to crack, resulting in device failure. In order to solve the problem, lead forming is generally used to increase the space for stress release. This article analyzes the problem that the lead size of CSOP devices does not meet the astronautical standard requirements. And through the Mechanical and thermal environmental tests and finite element simulation, the reliability of the CSOP devices is evaluated. Finally, the application suggestions are given: in practical application, it is recommended to carry out lead forming according to the standard requirements. If the lead forming size does not meet the standard requirements and is really needed, it is recommended to carry out solder joint morphology inspection and simulation fatigue life calculation to ensure the reliability of the device assembly.