Micro-Relays With Liquid Metal Dispersion

The fluidic properties of a system consisting of a liquid metal in an insulating fluid can be leveraged for reconfigurable switches responsive to non-contact and contact stimuli like electromagnetic fields and mechanical forces. Since liquid metal particles have significant electric polarizability, they are the most conducive to micromanipulation through low frequency electric fields. Herein, we demonstrate a switching application and fault repair mechanism exhibited by Eutectic Galn (EGaIn) microparticles dispersed in the insulating liquid medium of silicone oil. By virtue of being entirely fluid, the system retains its properties in variable mechanical configurations, enabling its applications in reconfigurable devices and soft robotics.

Authors

Institutions

Publication Details

Published
2025-06-22
DOI
https://doi.org/10.1109/fleps65444.2025.11105694
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Micro-Relays With Liquid Metal Dispersion

Haresh Kumar Singh, Renu Raman Sahu, S. Sreelal, Sanjiv Sambandan et al.
3 links
Electronic Packaging and Soldering Technologies
article

Micro-Relays With Liquid Metal Dispersion

Haresh Kumar Singh, Renu Raman Sahu, S. Sreelal, Sanjiv Sambandan, Sneha Chaudhary, Tapajyoti Das Gupta
article en

Abstract

The fluidic properties of a system consisting of a liquid metal in an insulating fluid can be leveraged for reconfigurable switches responsive to non-contact and contact stimuli like electromagnetic fields and mechanical forces. Since liquid metal particles have significant electric polarizability, they are the most conducive to micromanipulation through low frequency electric fields. Herein, we demonstrate a switching application and fault repair mechanism exhibited by Eutectic Galn (EGaIn) microparticles dispersed in the insulating liquid medium of silicone oil. By virtue of being entirely fluid, the system retains its properties in variable mechanical configurations, enabling its applications in reconfigurable devices and soft robotics.

Indian Institute of Science Bangalore (IN), Vikram Sarabhai Space Centre (IN)
Openalex Percentile: Top 82%
Electronic Packaging and Soldering Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.