An Equivalent Model of Fluid-Solid Heat-Transfer in Power Module of Motor Inverter

The power devices of motor inverter endure high current impact for a long time, which makes the junction temperature of power devices become one of the important factors affecting their reliability and life. Based on the application scenario of motor inverter, this paper introduces the solid heat transfer theory and fluid heat transfer theory. On this basis, a fluid-solid heat transfer equivalent model of motor inverter power module is constructed on Simulink. In comparison to COMSOL simulation, the heat transfer equivalent model simulation takes less time. In comparison to COMSOL simulation results, the maximum error is less than 1.5%, which proves the feasibility and accuracy of the model. It provides an efficient and low-cost simulation alternative for electronic package thermal design.

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Publication Details

Published
2025-07-11
DOI
https://doi.org/10.1109/eicct65471.2025.11100063
Primary Topic
Heat Transfer and Optimization
Type
article
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article

An Equivalent Model of Fluid-Solid Heat-Transfer in Power Module of Motor Inverter

Jiao Chen, Xin Li, Xiao Zeng, Junjie Hu
Heat Transfer and Optimization
article

An Equivalent Model of Fluid-Solid Heat-Transfer in Power Module of Motor Inverter

Jiao Chen, Xin Li, Xiao Zeng, Junjie Hu
article en

Abstract

The power devices of motor inverter endure high current impact for a long time, which makes the junction temperature of power devices become one of the important factors affecting their reliability and life. Based on the application scenario of motor inverter, this paper introduces the solid heat transfer theory and fluid heat transfer theory. On this basis, a fluid-solid heat transfer equivalent model of motor inverter power module is constructed on Simulink. In comparison to COMSOL simulation, the heat transfer equivalent model simulation takes less time. In comparison to COMSOL simulation results, the maximum error is less than 1.5%, which proves the feasibility and accuracy of the model. It provides an efficient and low-cost simulation alternative for electronic package thermal design.

Xihua University (CN)
Affordable and clean energy
Openalex Percentile: Top 81%
Heat Transfer and Optimization
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