A prototype pixel readout chip with column-level ADCs for high frame rate XFEL applications
Abstract X-ray Free Electron Laser (XFEL) facilities can deliver femtosecond X-ray pulses with ultra-high peak brightness, which in turn calls for high performance integrating-type pixel detectors. This work proposes a pixel readout ASIC (Application Specific Integrated Circuit) chip featuring a digital readout architecture designed to operate at a frame rate of 10 kHz for applications at next generation XFELs. The proposed design achieves a broad detection range from single-photon sensitivity to 10^4 photons at 12 keV by incorporating the dynamic gain-switching technique in the pixel front-end circuit. Each pixel column integrates an 11-bit SAR ADC, ensuring fast and accurate conversion of analog signals into digital domain. The digitized data is then transmitted via a serial chip interface. A small-scale prototype chip, consisting of a 16 × 16 pixel array, was designed and fabricated using a 130 nm CMOS process to validate the proposed architecture. This paper presents the design and experimental results of the prototype chip.
Authors
- T. Wang (ORCID: https://orcid.org/0000-0002-8422-4778)
- Z. M. Sheng (ORCID: https://orcid.org/0000-0002-8823-9993)
- S. Liu
- Fangyu Gan
- Tengjiao Sun
- Zhi Liu (ORCID: https://orcid.org/0000-0002-8973-6561)
- S. L. Lu
- Z. Ji
Institutions
- Chinese Academy of Sciences (CN)
- Fudan University (CN)
- ShanghaiTech University (CN)
- Shanghai Zhangjiang Laboratory (CN)
- Shanghai Fudan Microelectronics (China) (CN)
- Shanghai Institute of Microsystem and Information Technology (CN)
- University of Chinese Academy of Sciences (CN)
Publication Details
- Journal
- Journal of Instrumentation
- Published
- 2025-08-01
- DOI
- https://doi.org/10.1088/1748-0221/20/08/c08005
- Primary Topic
- CCD and CMOS Imaging Sensors
- Type
- article
- Field-Weighted Citation Impact
- 0.00