CHANNEL GEOMETRY OPTIMIZATION FOR MICROCHANNEL HEAT SINKS: AN EXPERIMENTAL AND NUMERICAL STUDY OF CIRCULAR, HYBRID, AND SQUARE CHANNELS UNDER CONTEMPORANEOUS EFFECT OF FLOWS

The escalating utilization of electronic modules with significant heat generation across diverse sectors, including medicine, aviation, and telecommunications, necessitates effective thermal management solutions. This research investigates the impact of microchannel heat-sink channel configurations on heat dissipation performance. The study aims to identify optimal channel geometry for enhancing heat transfer efficiency and decreasing the cooling time of microchannel heat sinks, which leads to prolonging the operational lifespan of these critical components. By fabricating and analyzing various heat sinks with different channel geometries under the simultaneous effects of fan and water flow, and by exploring suitable heat dissipation channels, this experimental and numerical work contributes to advancements in thermal management technologies for modern electronic systems. The study assesses heat dissipation in square, circular, and hybrid channel configurations under water-fan cooling. Square channels exhibit the best cooling, reaching 26°C at 5 mm, while circular channels record 32.5°C. The highest heat transfer coefficient is 1548 W/m<sup>2</sup> K for square channels, compared to 1332 W/m<sup>2</sup> K for circular ones. Square channels enhance turbulence and heat transfer but consume more energy, whereas circular channels are more energy-efficient but less effective in cooling. These insights aid in optimizing heat-sink designs for advanced thermal management in electronic systems.