Thermal Design and Analysis of Power Supply Module Based on Icepak

In recent years, electronic devices have been evolving towards higher power densities. As the size of electronic devices continues to shrink, the issue of component temperatures has become increasingly critical. This paper takes a power supply module as an example and performs thermal simulation calculations on a simplified model of the module using Icepak software. Through comparisons between simulation results and experimental data, an optimal heat dissipation pathway is designed for the module, addressing the issue of excessive component temperatures when heatsinks cannot be installed internally. Furthermore, the simulation modeling process and thermal analysis presented in this paper can serve as a reference for the thermal design of other power supply modules.