Research on Accelerated Life Testing and Reliability Prediction Technology for All Domestic Chip Relay Protection Devices

The domestically produced chip-based relay protection device has achieved a breakthrough from zero to one, but its reliability has not yet been tested in long-term operating environments. It is urgent to verify its reliability through accelerated life testing. This paper first analyzes the failure modes and mechanisms of typical relay protection devices. Based on this analysis, a targeted accelerated life testing plan is proposed, with three temperature stress levels set at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$90^{\circ} \mathrm{C}, 85^{\circ} \mathrm{C}$</tex>, and 80° C, each with 12 samples. According to the accelerated life test results, the activation energy <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{E a}$</tex> of the protection device is 0.7579, and its lifespan follows a two-parameter Weibull distribution (shape parameter 4.5660, scale parameter 291640). The Mean Time Between Failures (MTBF) is estimated to be 266370 hours, and the reliability curve of the protection device over time is provided. When the reliability is 0.95, the reliable lifespan is 17.37 years; when the reliability is 0.6, the reliable lifespan is 28.74 years. It can be concluded that the protection device has a relatively good level of reliability, meeting the current development and usage requirements for protection devices.