Hardware Design and Testing of Compact Power Submodule with 3.3 kV SiC Devices

This paper presents a compact half-bridge submodule hardware design based on a 3.3 kV SiC MOSFET, suitable for applications such as medium- to high-voltage motor drives, photovoltaic grid connection, and fast charging of electric vehicles. First, the selection of power device models was completed, followed by the determination of an appropriate isolated power supply and the design of a gate driver circuit with high CommonMode Transient Immunity (CMTI). The designed gate driver circuit integrates functions such as short-circuit protection, undervoltage protection, and Miller clamp. Additionally, the capacitor design solution was carefully evaluated, balancing the Equivalent Series Resistance (ESR), Equivalent Series Inductance (ESL), and volume of the capacitors, ultimately achieving a solution with high compactness and low ESL, with a capacitor volume of 1.8 L and an ESL of only 12.6 nH. The paper concludes with the development of a module prototype, along with the setup of a buck converter and a 1.5 kV double-pulse test platform to evaluate the performance of the designed submodule. Experimental results show that, under a switching speed of 50 kV/μs, the voltage overshoot during device turn-on is only 13.3%, and the parasitic inductances of the main circuit and bus capacitor are well controlled.

Authors

Institutions

Publication Details

Published
2025-05-23
DOI
https://doi.org/10.1109/ieecsc64206.2025.11099707
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Hardware Design and Testing of Compact Power Submodule with 3.3 kV SiC Devices

Yansheng Zou, Ran Zheng, Haibo Tang, Hong Lei et al.
Silicon Carbide Semiconductor Technologies
article

Hardware Design and Testing of Compact Power Submodule with 3.3 kV SiC Devices

Yansheng Zou, Ran Zheng, Haibo Tang, Hong Lei, Kai Xiao, Zixi Chen, Zihong Xie, Jianfeng Pan
article en

Abstract

This paper presents a compact half-bridge submodule hardware design based on a 3.3 kV SiC MOSFET, suitable for applications such as medium- to high-voltage motor drives, photovoltaic grid connection, and fast charging of electric vehicles. First, the selection of power device models was completed, followed by the determination of an appropriate isolated power supply and the design of a gate driver circuit with high CommonMode Transient Immunity (CMTI). The designed gate driver circuit integrates functions such as short-circuit protection, undervoltage protection, and Miller clamp. Additionally, the capacitor design solution was carefully evaluated, balancing the Equivalent Series Resistance (ESR), Equivalent Series Inductance (ESL), and volume of the capacitors, ultimately achieving a solution with high compactness and low ESL, with a capacitor volume of 1.8 L and an ESL of only 12.6 nH. The paper concludes with the development of a module prototype, along with the setup of a buck converter and a 1.5 kV double-pulse test platform to evaluate the performance of the designed submodule. Experimental results show that, under a switching speed of 50 kV/μs, the voltage overshoot during device turn-on is only 13.3%, and the parasitic inductances of the main circuit and bus capacitor are well controlled.

Chongqing University (CN), China Southern Power Grid (China) (CN)
Affordable and clean energy
Openalex Percentile: Top 82%
Silicon Carbide Semiconductor Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Hardware Design and Testing of Compact Power Submodule with 3.3 kV SiC Devices — Yansheng Zou, Ran Zheng, et al. · (2025) | TGRS Research Map | TGRS