Thermal Field Simulation of Influence of Internal Heat Dissipation in Power Cabinet on Power Device Temperature

With the trend toward high-power and miniaturized electronic devices, thermal flux density has surged from <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$10 ~\mathrm{W} / \text{cm}^{2}$</tex> to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$100 ~\mathrm{W} / \text{cm}^{2}$</tex>, exacerbating internal heat accumulation. Elevated temperatures significantly degrade device reliability, particularly for critical components such as IGBTs (Insulated Gate Bipolar Transistors) in power cabinets. While forced air-cooling systems are predominantly employed for thermal management, the mechanisms by which fan layout and airflow velocity influence cooling efficiency require further investigation. Additionally, since heat dissipation in power devices primarily relies on air cooling, the thermal reliability of these devices is directly tied to fan performance. To address this, COMSOL multiphysics simulations can be utilized to establish temperature field models. Through thermal source emulation and parametric analysis, the effects of fan positioning and airflow velocity on temperature distribution and their correlation with device thermal behavior can be systematically investigated. These insights enable optimized thermal design to ensure operational stability and facilitate predictive lifespan assessments of power devices.