Integration of 0.75 V V<sub>DD</sub> Oxide-Semiconductor 1T1C Memory with Advanced Logic for an Ultra-Low-Power Low-Latency Cache Solution

We successfully demonstrated the monolithic integration of a BEOL memory with advanced logic. The memory array is completely embedded in the BEOL, featuring an oxidesemiconductor channel selector and a low-temperature process capacitor. Yield and reliability were verified on a memory test chip operating at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$0.75 \mathrm{V} \mathrm{V}_{\text{DD}}$</tex>, with active energy lower than <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$0.5 \text{pJ} / \mathrm{b}$</tex> and a random cycle time of less than 8 ns, achieving retention exceeding 128 ms and endurance surpassing 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">14</sup> cycles at 85° C. This advanced logic-compatible BEOL memory technology offers a customizable, ultra-low-power, low-latency cache solution with a higher density than SRAM.

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Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11074854
Citations
5
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
3.65
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article

Integration of 0.75 V VDD Oxide-Semiconductor 1T1C Memory with Advanced Logic for an Ultra-Low-Power Low-Latency Cache Solution

Hsin‐Yi Yang, Yu-Jen Chien, Yongxun Liu, Yun-Feng Kao et al.
5 citations
Semiconductor materials and devices
3.65
article

Integration of 0.75 V VDD Oxide-Semiconductor 1T1C Memory with Advanced Logic for an Ultra-Low-Power Low-Latency Cache Solution

Hsin‐Yi Yang, Yu-Jen Chien, Yongxun Liu, Yun-Feng Kao, Chen-Han Chou, Katherine Chiang, Min Cao, Wai-Kit Lee, Ming-Yen Chuang, Yen-Chung Ho, Chih‐Yu Chang, Chengjun Wu, Yuxiao Wang, Jonathan Chang, Ya-Yun Cheng, Yu‐Chien Chiu, Pei-Jean Liao, Hiroki Noguchi, Yu-Ming Lin, Chung-Te Lin, Yin-Hao Wu, C.‐M. Huang
article en
5 citations

Abstract

We successfully demonstrated the monolithic integration of a BEOL memory with advanced logic. The memory array is completely embedded in the BEOL, featuring an oxidesemiconductor channel selector and a low-temperature process capacitor. Yield and reliability were verified on a memory test chip operating at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$0.75 \mathrm{V} \mathrm{V}_{\text{DD}}$</tex>, with active energy lower than <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$0.5 \text{pJ} / \mathrm{b}$</tex> and a random cycle time of less than 8 ns, achieving retention exceeding 128 ms and endurance surpassing 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">14</sup> cycles at 85° C. This advanced logic-compatible BEOL memory technology offers a customizable, ultra-low-power, low-latency cache solution with a higher density than SRAM.

Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Affordable and clean energy
Openalex Percentile: Top 7%
Semiconductor materials and devices
3.65
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