3D Interconnect Technology for Superconducting Quantum Devices
This paper introduces the results of research and development into 3D interconnect technology for the large-scale integration of superconducting quantum devices. We will introduce bump connections using superconducting materials and direct bonding technology.
Authors
- Yuuki Araga (ORCID: https://orcid.org/0000-0002-2081-3303)
- Hiroshi Nakagawa (ORCID: https://orcid.org/0000-0001-9368-519X)
- Katsuya Kikuchi (ORCID: https://orcid.org/0000-0001-7590-8409)
- Naoya Watanabe (ORCID: https://orcid.org/0000-0003-4274-0974)
Institutions
- National Institute of Advanced Industrial Science and Technology (JP)
Publication Details
- Published
- 2025-06-08
- DOI
- https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075048
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00