Record PMOS WSe<sub>2</sub> GAA Performance Using Contact Planarization, and Systematic Exploration of Manufacturable, High-Yield Contacts
Two-dimensional (2D) transition metal dichalcogenides (TMDs) hold significant promise for both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications. Here, we report new approaches to contact formation in global back gate 2D PMOS transistors using a manufacturable physical vapor deposition (PVD) sputtering process. We present a systematic study of novel sputtered contacts (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{Sb} / \text{Pt}, \text{Sb}_{2} \text{Te}_{3}$</tex>, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{Bi}_{2} \text{Te}_{3}$</tex>) to multilayer <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{WSe}_{2}$</tex> and through statistical analysis we discover trends of increasing performance with Pt thickness and post-metal anneal. Optimized conditions give <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{R}_{\mathrm{C}}$</tex> down to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1.3 \mathrm{k} \Omega. \mu \mathrm{m}$</tex> at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{N}(\text{inv})=1 \mathrm{e} 13 \text{cm}^{-2}$</tex> and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{I}_{\mathrm{d}, \max }=212 \mu \mathrm{A} / \mu \mathrm{m}$</tex> at <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{d}} =-1 \mathrm{V}$</tex>, the highest performance to date using sputtered contacts. Further, we pioneer a new approach to contact-first gate-allaround (GAA) schemes through contact planarization using chemical mechanical polishing (CMP). This first-of-kind CMP flow demonstrates significant performance gains over non-CMP contacts (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$4 \times$</tex>). CMP Ru contacts to monolayer <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{WSe}_{2}$</tex> GAA devices achieve record drive currents <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$>600 \mu \mathrm{A} / \mu \mathrm{m}$</tex> and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{SS}=132 \text{mV} / \text{dec}$</tex>.
Authors
- Richard Vreeland
- Uygar E. Avci (ORCID: https://orcid.org/0000-0002-0109-1923)
- Elizabeth C. Gillispie (ORCID: https://orcid.org/0000-0003-0408-016X)
- Pratyush Buragohain (ORCID: https://orcid.org/0000-0001-6744-3082)
- Tristan A. Tronic (ORCID: https://orcid.org/0000-0003-3285-6607)
- Ashish Verma Penumatcha (ORCID: https://orcid.org/0000-0002-0329-3721)
- K. Maxey
- Kevin P. O’Brien (ORCID: https://orcid.org/0000-0001-9213-6957)
- Marc Jaikissoon (ORCID: https://orcid.org/0000-0001-5102-6348)
- Kaan Oguz (ORCID: https://orcid.org/0000-0001-9574-0746)
- A. Oni
- Wouter Mortelmans (ORCID: https://orcid.org/0000-0002-1955-5925)
- N. Arefin
- Mahmut S. Kavrik (ORCID: https://orcid.org/0000-0002-0643-4964)
- Timothy M. Wilson (ORCID: https://orcid.org/0000-0003-2989-133X)
- A. Kitamura
- Carly Rogan
- Azimkhan Kozhakhmetov (ORCID: https://orcid.org/0000-0003-4743-8408)
- C. Engel
- Scott B. Clendenning
- Shane Harlson
- C. J. Dorow (ORCID: https://orcid.org/0000-0002-7593-4057)
- J. W. Kevek
- M. Metz
- J. Lux
- Herbert Barnett
- Z. Brooks
- Sai Siva Kumar Pinnepalli
- K. Toku
Institutions
- Intel (United States) (US)
Publication Details
- Published
- 2025-06-08
- DOI
- https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075202
- Citations
- 4
- Primary Topic
- Molecular Junctions and Nanostructures
- Type
- article
- Field-Weighted Citation Impact
- 2.92