BEOL Interconnects for 2nm Technology Node and Beyond
We present novel back-end-of-line (BEOL) copper interconnect integration for advanced technology nodes using low-k dielectric dep, binary liner metal gapfill process, radical assisted annealing, chemical mechanical planarization (CMP) and selective metal cap. Unit process and metrology data, electrical tests, Time Dependent Dielectric Breakdown (TDDB) reliability, Electromigration (EM) reliability and circuit simulations confirm significant power-performance-area (PPA) gains for 2nm technology node and beyond.
Authors
- Shashank Sharma (ORCID: https://orcid.org/0000-0001-9319-1325)
- Luca Larcher (ORCID: https://orcid.org/0000-0002-9139-349X)
- Guangzhi Qu (ORCID: https://orcid.org/0000-0003-4047-9514)
- Shi You
- Ben Ng (ORCID: https://orcid.org/0000-0003-4418-5054)
- Max Gage
- Roey Shaviv
- Enrico Piccinini (ORCID: https://orcid.org/0000-0001-6975-5872)
- Keyvan Kashefizadeh
- Jianshe Tang (ORCID: https://orcid.org/0000-0003-2370-2091)
- Zhebo Chen (ORCID: https://orcid.org/0000-0002-8448-4211)
- Andy Y. H. Lo (ORCID: https://orcid.org/0000-0002-0790-4323)
- Zhiyuan Wu (ORCID: https://orcid.org/0000-0001-7419-7326)
- Hussam Amrouch (ORCID: https://orcid.org/0000-0002-5649-3102)
- Sree Kesapragada
- Gaurav Thareja
- Chi-I Lang
- Albi Mema (ORCID: https://orcid.org/0000-0001-7841-1975)
- Munehiro Tada (ORCID: https://orcid.org/0000-0002-1015-2222)
- Andrea Palmieri
- Davide Cornigli (ORCID: https://orcid.org/0000-0002-1683-5200)
- Shankar Muthukrishnan
- Michael Haverty
- Xingye Wang (ORCID: https://orcid.org/0009-0007-2581-7809)
- Sameer Deshpande (ORCID: https://orcid.org/0000-0002-9832-8383)
- Alexander Jansen
- Takahisa Tanaka (ORCID: https://orcid.org/0000-0001-6788-8436)
- Li Qun Xia
- Jaehyun Lee (ORCID: https://orcid.org/0000-0002-8322-1524)
- Ren He (ORCID: https://orcid.org/0000-0003-1208-7089)
- Bo Xie
- F. Nardi (ORCID: https://orcid.org/0009-0003-0537-5442)
- Yanping Wu (ORCID: https://orcid.org/0000-0001-5830-4582)
- Nicola Giuliani
- Brian J. Brown
- Monika Jamieson
- Norman Tam
- Xianmin Tang
- Mehul Naik
- Swetha Barkam
- Mathew Spuller
- Francis Kanyiri Mungai
- Maarten Berkens
Institutions
- Applied Materials (United States) (US)
- Keio University (JP)
- Technical University of Munich (DE)
Publication Details
- Published
- 2025-06-08
- DOI
- https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075093
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00