A Hybrid Monolithic 3D Integration of 2T0C DRAM and RRAM Chip for High-Precision In-Memory Point Cloud Acceleration with Ultra-Fine-Grained Dataflow

In this work, we propose the hybrid monolithic 3D (H-M3D) computing-in-memory (CIM) accelerator to address the challenges of frequent data granularity in existing point cloud acceleration on edge devices. By integrating and orchestrating high-precision 2T0C DRAM CIM and RRAM CIM for Euclidean distance (L2D) and matrix-vector multiplication (MVM) operations, we achieve efficient feature computation and refine the dataflow granularity to individual points, enabling high-speed data transmission. The proposed M3D-CIM point cloud system demonstrates <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1.51 \times$</tex> speedup and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.56 \times$</tex> enhancement in energy efficiency, providing a novel solution for point cloud acceleration on edge devices.

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Publication Details

Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11074962
Citations
4
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
2.92
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article

A Hybrid Monolithic 3D Integration of 2T0C DRAM and RRAM Chip for High-Precision In-Memory Point Cloud Acceleration with Ultra-Fine-Grained Dataflow

Yi Qin Gao, Rui Hua Xie, Jingwei Sun, Yimao Cai et al.
4 citations
3D IC and TSV technologies
2.92
article

A Hybrid Monolithic 3D Integration of 2T0C DRAM and RRAM Chip for High-Precision In-Memory Point Cloud Acceleration with Ultra-Fine-Grained Dataflow

Yi Qin Gao, Rui Hua Xie, Jingwei Sun, Yimao Cai, Haisu Zhang, Zongwei Wang, Lin Bao, Ling Liang
article en
4 citations

Abstract

In this work, we propose the hybrid monolithic 3D (H-M3D) computing-in-memory (CIM) accelerator to address the challenges of frequent data granularity in existing point cloud acceleration on edge devices. By integrating and orchestrating high-precision 2T0C DRAM CIM and RRAM CIM for Euclidean distance (L2D) and matrix-vector multiplication (MVM) operations, we achieve efficient feature computation and refine the dataflow granularity to individual points, enabling high-speed data transmission. The proposed M3D-CIM point cloud system demonstrates <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1.51 \times$</tex> speedup and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.56 \times$</tex> enhancement in energy efficiency, providing a novel solution for point cloud acceleration on edge devices.

Peking University (CN)
Affordable and clean energy
Openalex Percentile: Top 9%
3D IC and TSV technologies
2.92
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A Hybrid Monolithic 3D Integration of 2T0C DRAM and RRAM Chip for High-Precision In-Memory Point Cloud Acceleration with Ultra-Fine-Grained Dataflow — Yi Qin Gao, Rui Hua Xie, et al. · (2025) | TGRS Research Map | TGRS