A Hybrid Monolithic 3D Integration of 2T0C DRAM and RRAM Chip for High-Precision In-Memory Point Cloud Acceleration with Ultra-Fine-Grained Dataflow
In this work, we propose the hybrid monolithic 3D (H-M3D) computing-in-memory (CIM) accelerator to address the challenges of frequent data granularity in existing point cloud acceleration on edge devices. By integrating and orchestrating high-precision 2T0C DRAM CIM and RRAM CIM for Euclidean distance (L2D) and matrix-vector multiplication (MVM) operations, we achieve efficient feature computation and refine the dataflow granularity to individual points, enabling high-speed data transmission. The proposed M3D-CIM point cloud system demonstrates <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1.51 \times$</tex> speedup and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.56 \times$</tex> enhancement in energy efficiency, providing a novel solution for point cloud acceleration on edge devices.
Authors
- Yi Qin Gao (ORCID: https://orcid.org/0000-0002-4309-9376)
- Rui Hua Xie (ORCID: https://orcid.org/0000-0002-0177-4417)
- Jingwei Sun (ORCID: https://orcid.org/0000-0001-5098-1503)
- Yimao Cai (ORCID: https://orcid.org/0000-0002-6854-8211)
- Haisu Zhang (ORCID: https://orcid.org/0000-0001-7823-6257)
- Zongwei Wang
- Lin Bao (ORCID: https://orcid.org/0000-0002-3146-6124)
- Ling Liang (ORCID: https://orcid.org/0009-0007-2637-9708)
Institutions
- Peking University (CN)
Publication Details
- Published
- 2025-06-08
- DOI
- https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11074962
- Citations
- 4
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 2.92