A 3D-Integrated 56 Gb/s Silicon Photonic Transceiver with 5nm CMOS Electronics for Optical Compute Interconnects

This work presents a hybrid-integrated silicon photonic <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\text{SiPh})$</tex> transceiver suitable for realizing chiplet-based optical <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{I}/\mathrm{O}$</tex> in future <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{AI}/\text{ML}$</tex> ASIC packages. The transceiver die stack consist of two ICs: a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{SiP}\overline{\mathrm{h}}$</tex> IC (PIC) with compact, thermally stable electro-absorption modulators (EAMs), and a 5 nm CMOS electronic IC (EIC) with 56 Gb /s NRZ SerDes and optical interface circuits. A stacked CMOS EAM driver delivers 1.8 Vpp modulation voltage, achieving 3.5 dB extinction ratio. Transmit equalization and inductive peaking help accommodate sub-Nyquist RX analog front-end bandwidth, thereby reducing additive thermal noise from RX electronics. The complete 56 Gb <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$/\mathrm{s}$</tex> NRZ optical link consisting of the fiber-attached 3D SiPh transceiver and an external packaged light engine achieves BER <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$&lt; 10^{-9}$</tex> with <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$&lt; -10.7\text{dBm}$</tex> RX OMA while dissipating 2.8 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{pJ}/\text{bit}$</tex>. The transceiver electronics consumes only 0.09 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{mm}^{\overline{2}}$</tex> area, delivering more than 600 Gb <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$/\mathrm{s}/\text{mm}^{2}$</tex> areal bandwidth density.

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Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075134
Primary Topic
Photonic and Optical Devices
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article
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article

A 3D-Integrated 56 Gb/s Silicon Photonic Transceiver with 5nm CMOS Electronics for Optical Compute Interconnects

Maruf Hossain, Parmanand Mishra, Shruthi Ramachandra, Phil Winterbottom et al.
Photonic and Optical Devices
article

A 3D-Integrated 56 Gb/s Silicon Photonic Transceiver with 5nm CMOS Electronics for Optical Compute Interconnects

Maruf Hossain, Parmanand Mishra, Shruthi Ramachandra, Phil Winterbottom, Sejun Jeon, S. Forey, David Lazovsky, Preeti Thakur, Ankita Aggarwal, Saurabh Vats, Subal Sahni, Parveen K. Goyal, Matteo Staffaroni, G. Balamurugan, Kyoung‐mi Park, S. Yu, H. Eachempatti, Hemesh Yasotharan, R. Nagulapalli, R. Yazdani, Waheed A. Younis, P. Virk, S. Hariwan
article en

Abstract

This work presents a hybrid-integrated silicon photonic <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\text{SiPh})$</tex> transceiver suitable for realizing chiplet-based optical <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{I}/\mathrm{O}$</tex> in future <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{AI}/\text{ML}$</tex> ASIC packages. The transceiver die stack consist of two ICs: a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{SiP}\overline{\mathrm{h}}$</tex> IC (PIC) with compact, thermally stable electro-absorption modulators (EAMs), and a 5 nm CMOS electronic IC (EIC) with 56 Gb /s NRZ SerDes and optical interface circuits. A stacked CMOS EAM driver delivers 1.8 Vpp modulation voltage, achieving 3.5 dB extinction ratio. Transmit equalization and inductive peaking help accommodate sub-Nyquist RX analog front-end bandwidth, thereby reducing additive thermal noise from RX electronics. The complete 56 Gb <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$/\mathrm{s}$</tex> NRZ optical link consisting of the fiber-attached 3D SiPh transceiver and an external packaged light engine achieves BER <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$&lt; 10^{-9}$</tex> with <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$&lt; -10.7\text{dBm}$</tex> RX OMA while dissipating 2.8 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{pJ}/\text{bit}$</tex>. The transceiver electronics consumes only 0.09 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{mm}^{\overline{2}}$</tex> area, delivering more than 600 Gb <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$/\mathrm{s}/\text{mm}^{2}$</tex> areal bandwidth density.

Northampton Community College (US), Santa Clara University (US), Hain Celestial (Canada) (CA), Carleton University (CA)
Affordable and clean energy
Openalex Percentile: Top 82%
Photonic and Optical Devices
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