Key Technologies and Performance Aspects for Electrical and Optical Interconnects

High-Performance Computing (HPC) modules and their ever-increasing data bandwidth require conversion of electrical signals to photons. We present the next generation to Occamy [1] electrical only HPC system to include optical interconnects addressing bandwidth, manufacturing scalability, and power efficiency challenges in future data center systems. As datacenter HPC modules rapidly transition to electrical/optical interconnects, GlobalFoundries has developed a compatible electrical to optical interconnect advanced packaging solution with its partner ecosystem. In this paper, we provide an overview of some of the advances in integration and characterization of electro/optical modules and discuss trends of current and future combined electrical and optical interconnects. Key performance aspects and features include high power low-loss edge couplers, best-in-class high-speed micro-ring modulators, Mach-Zehnder modulators, and photodetectors. GlobalFoundries' next generation Fotonix<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TM</sup> (45SPCLO) technology was created as a high performance electro-optical interconnect platform with monolithic integration of Photonics and RF class CMOS devices on the same die as integrated V-grooves for fiber attachment solutions and Through Silicon Vias (TSVs) for advanced packaging high speed electrical connections.