An Active Silicon Perforated Mea for Seamless 3D Organoid Interfacing with Low-Noise, Scalable Multimodal Electrophysiology

We present the first active silicon perforated MEA for 3D organoid interfacing, integrating CMOS electronics for lownoise, high-resolution recording, stimulation, and impedance spectroscopy (EIS) across 7 modalities. The MEA, fabricated in 130 nm CMOS technology, features a scalable 256 -island mesh with multiplexed operation, achieving low input-referred noise (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$9.1 \pm 1.5 \mu \mathrm{V}_{\text {rms }}, 300 \text{Hz}-10 \text{kHz}$</tex>) and low power (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$11.3 \mu \mathrm{W}$</tex> per island). In vitro tests with cardiomyocytes demonstrate accurate recordings, network propagation mapping, and intracellular recordings via voltage stimulation. This perforated MEA offers unparalleled functionality and scalability for advancing organ-on-chip research.