First Demonstration of Fluorine-Treated IGZO FETs with Record-Low Positive Bias Temperature Instability $\left(\left\vert \Delta V_{\text{TH}}\right\vert<44 \text{mV}\right)$ at an Elevated Temperature (395 K)

We present here the reliability enhancement of BEOL-compatible ITO-enhanced fluorine-treated IGZO transistors (IGZO:F FETs). The IGZO FETs exhibit a record-low <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\left\vert \Delta V_{\text{TH}}\right\vert$</tex> of 43.7 mV at an elevated temperature of 395 K under a high oxide electric field (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$E_{\text{OX}}$</tex>) of 4 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{MV} / \text{cm}$</tex> for 1 ks, while maintaining excellent electrical performance. For the first time, we propose an atomic-level mechanism that explains how fluorine doping modulates migration barrier and path of hydrogen <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{H})$</tex> that contributes to enhanced reliability in oxide FETs.

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Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075017
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
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article
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article

First Demonstration of Fluorine-Treated IGZO FETs with Record-Low Positive Bias Temperature Instability $\left(\left\vert \Delta V_{\text{TH}}\right\vert<44 \text{mV}\right)$ at an Elevated Temperature (395 K)

Xiao Gong, Zihang Fang, Xuanqi Chen, Evgeny Zamburg et al.
Advancements in Semiconductor Devices and Circuit Design
article

First Demonstration of Fluorine-Treated IGZO FETs with Record-Low Positive Bias Temperature Instability $\left(\left\vert \Delta V_{\text{TH}}\right\vert<44 \text{mV}\right)$ at an Elevated Temperature (395 K)

Xiao Gong, Zihang Fang, Xuanqi Chen, Evgeny Zamburg, Aaron Thean, Quanzhen Wan, Sonu Hooda, Zhi Gen Yu, Renzhuo Wan, Maheswari Sivan, Baoshan Tang, Wenhui Wang, Yong‐Wei Zhang
article en

Abstract

We present here the reliability enhancement of BEOL-compatible ITO-enhanced fluorine-treated IGZO transistors (IGZO:F FETs). The IGZO FETs exhibit a record-low <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\left\vert \Delta V_{\text{TH}}\right\vert$</tex> of 43.7 mV at an elevated temperature of 395 K under a high oxide electric field (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$E_{\text{OX}}$</tex>) of 4 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{MV} / \text{cm}$</tex> for 1 ks, while maintaining excellent electrical performance. For the first time, we propose an atomic-level mechanism that explains how fluorine doping modulates migration barrier and path of hydrogen <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{H})$</tex> that contributes to enhanced reliability in oxide FETs.

Agency for Science, Technology and Research (SG), National University of Singapore (SG), Institute of High Performance Computing (SG)
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Advancements in Semiconductor Devices and Circuit Design
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