NanoStack Transistor Architecture for CMOS 7A Node and Beyond

NanoStack is a sequential stacking CMOS transistor architecture featuring flexible placement of top and bottom nanosheet channels, thermally stable bottom FET gate stack, thin dielectric bonding and more. We project NanoStack with 4-track base cells to deliver <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\sim$</tex> 50% area scaling, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\sim$</tex> 50% iso-power performance improvement or <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\sim$</tex> 70% iso-performance power reduction with respect to the 2nm node, fulfilling fundamental requirements for a competitive multi-node CMOS architecture beyond nanosheet. We demonstrate here for the first time a manufacturable sequential integration of multi-channel nanosheet-on-nanosheet NanoStack CMOS featuring ultra-scaled vertical inter-FET isolation.

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Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11074866
Citations
5
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
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article
Field-Weighted Citation Impact
3.65
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article en
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Abstract

NanoStack is a sequential stacking CMOS transistor architecture featuring flexible placement of top and bottom nanosheet channels, thermally stable bottom FET gate stack, thin dielectric bonding and more. We project NanoStack with 4-track base cells to deliver <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\sim$</tex> 50% area scaling, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\sim$</tex> 50% iso-power performance improvement or <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\sim$</tex> 70% iso-performance power reduction with respect to the 2nm node, fulfilling fundamental requirements for a competitive multi-node CMOS architecture beyond nanosheet. We demonstrate here for the first time a manufacturable sequential integration of multi-channel nanosheet-on-nanosheet NanoStack CMOS featuring ultra-scaled vertical inter-FET isolation.

IBM (United States) (US)
Affordable and clean energy
Openalex Percentile: Top 7%
Advancements in Semiconductor Devices and Circuit Design
3.65
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