First Implementation of Monolithic Integrated Cim with 1Mb Ultra-High-Density 8-Layer 3D VRRAM, Achieving High Computing Density ($204.8 \text{GOPs} / \text{mm}^{2}$) and FoM ($\mathbf{2. 1 3} \times \mathbf{1 0}^{\mathbf{6}} \text{GOPS}^{\mathbf{2}}

This work firstly implemented the Monolithic Integration of ultra-high density 1 Mb 8-layer 3D Vertical RRAM based Computing-In-Memory chip (MI-3DCIM) for efficient scientific computing. The 3D VRRAM performs in-situ matrix-vector multiplication (MVM) and transmits data to underlying computational circuits via the BEOL metal interconnects, which is embedded with the on-chip processor, enabling a fully monolithic SoC. Benefiting from the reduced latency and energy consumption, the MI-3DCIM exhibits ultra-high computational density (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$204.8 \text{GOPS} / \text{mm}^{2}$</tex>), high energy efficiency (10.4 TOPS/W) and superior Figure of Merit (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.13 \times 10^{6} \text{GOPS}^{2} / \mathrm{W} / \text{mm}^{2}$</tex>). This novel 3DCIM chip greatly enhances the capability for complex tasks.