Integrated Optical and Electrical Connectivity in Advanced Packaging: The Role of Glass Substrates

This paper discusses the growing role of glass substrates in advanced packaging solutions, driven by the increasing demands of heterogeneous integration and high-speed data communication. Glass substrates offer beneficial attributes such as large panel scalability and excellent surface quality, coupled with its integration with electrical metallization and low loss waveguides with low-pitch capability, make it a key player in this arena. We report on the fabrication of an integrated glass packaging solution using ion-exchange (IOX) waveguides, cavity based thin film metallization, and laser singulation.