Advanced VCSEL Integration and Assembly Technologies

Techniques of integrating Vertical Cavity Surface Emitting Lasers (VCSELs) into high density and high-speed optical interconnects are described. Examples include micro transfer printable (MTP) VCSELs, wafer scale solder bumping, and wafer scale lens integration for both top and bottom side emitters

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Published
2025-06-16
DOI
https://doi.org/10.1109/oip65843.2025.11081547
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
Field-Weighted Citation Impact
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article

Advanced VCSEL Integration and Assembly Technologies

Pritha Khurana, James K. Guenter, Jim A. Tatum, Luke A. Graham
Semiconductor Lasers and Optical Devices
article

Advanced VCSEL Integration and Assembly Technologies

Pritha Khurana, James K. Guenter, Jim A. Tatum, Luke A. Graham
article en

Abstract

Techniques of integrating Vertical Cavity Surface Emitting Lasers (VCSELs) into high density and high-speed optical interconnects are described. Examples include micro transfer printable (MTP) VCSELs, wafer scale solder bumping, and wafer scale lens integration for both top and bottom side emitters

Quantum Devices (United States) (US)
Openalex Percentile: Top 82%
Semiconductor Lasers and Optical Devices
DOISourceOpenAlex
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Advanced VCSEL Integration and Assembly Technologies — Pritha Khurana, James K. Guenter, et al. · (2025) | TGRS Research Map | TGRS