First Demonstration of Atomic-Interlayer-Tuning Driven by First Principles Calculations and Atomic Layer Deposition Towards High Thermal Stable BEOL IGZO-FETs with SS=62mV/dec, PBTI < 7mV@ 3MV/cm and 353K

In this work, first principles calculations, combining AIMD and static calculation are incorporated in the ALD co-designing of IGZO-FETs for the first time, providing in-depth study into the defect kinetics. With emulation of ALD, the optimized IGZO-FETs with outstanding stability up to 500°C is achieved: (1) Sub-0.5nm ALD InO interlayer strengthens the PBTI stability by 51 times @3.5MV/cm, from <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\Delta} V_{\text{th}}=+174.1 \text{mV}$</tex> (5.7V<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup>) to 3.4mV (294.1V<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup>). (2) PBTI = +6.9 mV; (3) 12.1mV @ +3MV/cm and 393K; (4) Endurance > 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup> cycle with AC <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$V_{\mathrm{g},\text{bias}} \sim 2.8 \mathrm{V}$</tex>. The first-principles assisted experimental design is practically powerful for oxide FETs with multi-elements and complicated processing methods, and accelerating path-finding of Back-End-of-Line (BEOL) thermal stability enhancement.

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Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075061
Citations
2
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
1.46

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article

First Demonstration of Atomic-Interlayer-Tuning Driven by First Principles Calculations and Atomic Layer Deposition Towards High Thermal Stable BEOL IGZO-FETs with SS=62mV/dec, PBTI < 7mV@ 3MV/cm and 353K

Ziheng Bai, Xinlv Duan, Di Geng, Chuanke Chen et al.
2 citations
Semiconductor materials and devices
1.46
article

First Demonstration of Atomic-Interlayer-Tuning Driven by First Principles Calculations and Atomic Layer Deposition Towards High Thermal Stable BEOL IGZO-FETs with SS=62mV/dec, PBTI < 7mV@ 3MV/cm and 353K

Ziheng Bai, Xinlv Duan, Di Geng, Chuanke Chen, Zhicheng Wu, Lingfei Wang, Guanhua Yang, Ling Li, Nannan You, Weiwei Li, Tong Yu, Yue Zhao, Shundong Hu, Jiawei Wang, Rui Chen, Chunyu Zhang, Jiayi Wang, Chen Gu, Xufan Li, Nianduan Lu, Tianhao Liao, Ming Liu
article en
2 citations

Abstract

In this work, first principles calculations, combining AIMD and static calculation are incorporated in the ALD co-designing of IGZO-FETs for the first time, providing in-depth study into the defect kinetics. With emulation of ALD, the optimized IGZO-FETs with outstanding stability up to 500°C is achieved: (1) Sub-0.5nm ALD InO interlayer strengthens the PBTI stability by 51 times @3.5MV/cm, from <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\Delta} V_{\text{th}}=+174.1 \text{mV}$</tex> (5.7V<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup>) to 3.4mV (294.1V<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup>). (2) PBTI = +6.9 mV; (3) 12.1mV @ +3MV/cm and 393K; (4) Endurance > 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup> cycle with AC <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$V_{\mathrm{g},\text{bias}} \sim 2.8 \mathrm{V}$</tex>. The first-principles assisted experimental design is practically powerful for oxide FETs with multi-elements and complicated processing methods, and accelerating path-finding of Back-End-of-Line (BEOL) thermal stability enhancement.

Integrated Chinese Medicine (China) (HK)
National Natural Science Foundation of China, National Key Research and Development Program of China
Openalex Percentile: Top 16%
Semiconductor materials and devices
1.46
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