Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement
In this work, we have developed a compressive SiN (c-SiN) diffusion break (DB) dielectric stressor for gate-all-around nanosheet (GAA-NS) transistor to improve the pFET device and reduce intrinsic nFET/pFET performance offset in this technology. A significant amount of stress in short channel (SC) Si pFET devices is induced through DB gate replacement using compressive SiN (c-SiN) with customized treatment. We report an additional stress in SC NS pFET devices post channel release of ∼700MPa induced by cSiN DB stressors, leading to a corresponding Ieff-Ioff performance benefit of 25% on pFET logic devices at scaled CPP with no degradation of the short channel effects and reliability. As expected, the improvement is greater as the devices are closer to the c-SiN DB stressor with a strong dependence on the active length.
Authors
- S. Mochizuki
- S. C. H. Hung (ORCID: https://orcid.org/0000-0003-1604-8562)
- J. Li
- El Mehdi Bazizi (ORCID: https://orcid.org/0000-0002-2053-6270)
- V. Chen
- Changbin Zhao (ORCID: https://orcid.org/0000-0002-7532-6879)
- H. Zhou (ORCID: https://orcid.org/0000-0002-9153-3675)
- B. Peethala (ORCID: https://orcid.org/0000-0001-6221-5929)
- Arthur Gasasira
- Xiaoli He (ORCID: https://orcid.org/0000-0002-4519-3550)
- Mohd Tariq (ORCID: https://orcid.org/0000-0002-5162-7626)
- B. Haran
- Hong Chen (ORCID: https://orcid.org/0000-0002-3762-3565)
- B. Colombeau
- Ashish Pal (ORCID: https://orcid.org/0000-0002-7753-2051)
- N. Loubet
- P. Anekal
Institutions
- IBM (United States) (US)
- Applied Materials (United States) (US)
Publication Details
- Published
- 2025-06-08
- DOI
- https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075052
- Primary Topic
- Advancements in Semiconductor Devices and Circuit Design
- Type
- article
- Field-Weighted Citation Impact
- 0.00