Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement

In this work, we have developed a compressive SiN (c-SiN) diffusion break (DB) dielectric stressor for gate-all-around nanosheet (GAA-NS) transistor to improve the pFET device and reduce intrinsic nFET/pFET performance offset in this technology. A significant amount of stress in short channel (SC) Si pFET devices is induced through DB gate replacement using compressive SiN (c-SiN) with customized treatment. We report an additional stress in SC NS pFET devices post channel release of ∼700MPa induced by cSiN DB stressors, leading to a corresponding Ieff-Ioff performance benefit of 25% on pFET logic devices at scaled CPP with no degradation of the short channel effects and reliability. As expected, the improvement is greater as the devices are closer to the c-SiN DB stressor with a strong dependence on the active length.

Authors

Institutions

Publication Details

Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075052
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement

S. Mochizuki, S. C. H. Hung, J. Li, El Mehdi Bazizi et al.
Advancements in Semiconductor Devices and Circuit Design
article

Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement

S. Mochizuki, S. C. H. Hung, J. Li, El Mehdi Bazizi, V. Chen, Changbin Zhao, H. Zhou, B. Peethala, Arthur Gasasira, Xiaoli He, Mohd Tariq, B. Haran, Hong Chen, B. Colombeau, Ashish Pal, N. Loubet, P. Anekal
article en

Abstract

In this work, we have developed a compressive SiN (c-SiN) diffusion break (DB) dielectric stressor for gate-all-around nanosheet (GAA-NS) transistor to improve the pFET device and reduce intrinsic nFET/pFET performance offset in this technology. A significant amount of stress in short channel (SC) Si pFET devices is induced through DB gate replacement using compressive SiN (c-SiN) with customized treatment. We report an additional stress in SC NS pFET devices post channel release of ∼700MPa induced by cSiN DB stressors, leading to a corresponding Ieff-Ioff performance benefit of 25% on pFET logic devices at scaled CPP with no degradation of the short channel effects and reliability. As expected, the improvement is greater as the devices are closer to the c-SiN DB stressor with a strong dependence on the active length.

IBM (United States) (US), Applied Materials (United States) (US)
Affordable and clean energy
Openalex Percentile: Top 82%
Advancements in Semiconductor Devices and Circuit Design
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement — S. Mochizuki, S. C. H. Hung, et al. · (2025) | TGRS Research Map | TGRS